System 100- Plasma Etching and Deposition Equipment

This device is a flexible and powerful plasma etching and deposition process equipment. The use of a vacuum injection chamber allows for rapid chip replacement, the use of multiple process gases, and the expansion of the allowable temperature range.

Featuring maximum process flexibility, suitable for compound semiconductors, optoelectronics, photonics, microelectromechanical systems, and microfluidic technology, The PlasmalabSystem100 can have many configurations, as detailed below.

main features

• Capable of processing 8 "chips and also capable of small batch (6 × 2") prefabrication and trial production

• Choose single crystal wafer/batch processing or box injection, and use a vacuum injection chamber. The PlasmalabSystem100 can be integrated into a cluster system, using a central robotic arm to transport chips, and the production process uses full wafer box to wafer box transfer Using a series of electrodes for substrate temperature control, with a temperature range of -150 ° C to 700 ° C

• Laser interference and/or light emission spectra for terminal detection can be installed on the Plasmalab System100 to enhance etching control

• The selected 6 or 12 gas boxes provide flexibility in the selection of process flow and process gases, and can be placed remotely, away from major process equipment

workmanship
Some examples of using Plasmalab System100 plasma etching and deposition equipment:

• Low temperature silicon etching, deep silicon etching, and SOI processes applied to MEMS, microfluidic technology, and photonics technology

• III-V group etching process for laser endfaces, using etched holes, photonic crystals, and many other applications, with a wide range of materials (InP, InSb, InGaAs, GaAs, AlGaAs, GaN, AlGaN, etc.)

• Pre production and R&D processes for GaN, AlGaN, etc., such as etching for HBLED and other power devices

• High quality, high-speed SiO2 deposition, applied to photonic devices

• Metal (Nb, W) etching

The latest single-crystal etching technology - PlasmaPro100 Sapphire. Oxford Instruments is committed to technological innovation in solid-state lighting. With extensive experience in HBLED related materials, cost control of equipment usage, and compliance with production requirements, our new technology can also maximize customer product yield.
In response to the chemical environment requirements for HBLED etching, PlasmaPro100 Sapphire has a special design that allows for rapid and uniform etching on chips with a diameter of 200mm. Oxford Instruments has always strived to provide customers with innovative, cost effectively controlled, and reliable process solutions. This latest designed device meets all the requirements.
The main features and advantages include: exclusive electrostatic suction cup technology, which can fix sapphire and grow gallium nitride on sapphire or silicon; High power ICP can produce high-density plasma; Magnetic isolation zone can improve ion control and uniformity; The high conductivity pump water system can maximize the transportation of gas under low pressure.