High resolution 2D and 3DXRadiation systemFF70 CL

High resolution 2D and 3D for fully automated analysis of minimum defectsXRay system

Due to defects in chips, substrates, tapes, or components of the final product, automated, high-quality, reliable, and fast non-destructive testing and analysis are required in semiconductor manufacturing to achieve optimal production. new-typeFF70 CL XThe radiographic testing system is specifically designed for optimal automated analysis of the smallest and most demanding defects in these samples. Result: The testing and detection are very accurate and reproducible, with excellent performance.

l Improve quality monitoring by inspecting more locations with higher resolution to identify potential missed faults

l Significantly reduce costs and increase production through better testing coverage

l Reliable and repeatable checks can be conducted at any time for the consistency of process and defect parameters

l This innovative automated analysis solution is easy to use and optimizes operational costs

System capability

FF70 CLHaving a large detection area, i.e,510 x 610mm, as well as extremely fine detection depth, i.e., less than150nmIt is very suitable for automatic and non-destructive analysis of solder bumps and filled vias in 3D integrated circuits, chips, and chips.

The innovative vacuum mechanism of the system console can safely and accurately maintain the sample during the analysis process, and counteract the effects of sample warping.

FF70 CLProvide two-dimensional (top-down) high-performance flat panel detectors and three-dimensional（CL-Automated analysis using computer layered photography, utilizing high-resolution image intensifiers for tilt and rotation within special operating components.

The latest generation of nanofocusXThe X-ray tube can generate two-dimensional and three-dimensional images that can display and measure the minimum gap and function, enablingFF70 CLCapable of analyzing the most demanding advanced semiconductor challenges.

Graphical user interface（GUI）Easy to use and intuitive, allowing users to easily create automated, multi-point, and multifunctional analysis and detection programs.

Automatic and continuous background calibration testing of various aspects of the monitoring system can ensure measurement repeatability over time.

List of System Attributes:

l Capable of performing automated high-throughput analysis with good repeatability and reliable results

l Can easily create automated, multi-point, and multifunctional analysis and detection programs, allowing for rapid changes between samples and measurement tasks

l Can perform continuous background monitoring and optimization to ensure measurement repeatability and accuracy

Technical data