Thermo Scientific ™ Helios ™ 5 Laser PFIB large volume 3D analysis, Ga free sample preparation, and precision microfabrication. An innovative and fully integrated femtosecond laser that provides material removal efficiency and cutting surface quality, is a high-quality subsurface and 3D characterization device in the millimeter scale and nanometer resolution range.
Femtosecond laser PFIB
Zui Large Volume: 2000 × 2000 × 1000 μ m3
Maximum beam current:~1mA (equivalent to ion beam current)
Cutting beam current: 74 μ A
Beam spot size: 15 μ m
Laser Integration: Three beams (SEM/PFIB/laser) are fully integrated in the sample chamber and have the same overlap point,
Realize precise and repeatable cutting positions and 3D representations.
First harmonic: wavelength 1030 nm (infrared), pulse width<280 fs
Second harmonic: wavelength 515 nm (green), pulse width<300 fs
Electronic Optics:
☆ Three beam overlap point WD=4 mm (same as SEM/FIB)
☆ Variable objective lens (electric)
☆ Polarization: horizontal/vertical
☆ Repetition rate: 1 kHz~1 MHz
☆ Beam positioning accuracy:<250 nm
Protective barrier: Automatic SEM/PFIB protective barrier
Software:
☆ Laser control software
☆ Laser 3D continuous slicing workflow
☆ EBSD laser 3D continuous slicing workflow
☆ Laser programming control script*
Safety: Interlocking laser protective cover (Class 1 laser safety)
Characteristics and Applications:
☆ Millimeter level cross-sectional material removal, with a material removal rate 15000 times faster than typical Ga+FIB
☆ Achieve statistical analysis of subsurface and three-dimensional data by collecting larger volumes in a shorter amount of time
☆ Accurate and repeatable cutting position, with three beams intersecting at the same point on the sample
☆ Rapid characterization of deep subsurface features by extracting TEM thin films or blocks for three-dimensional analysis
☆ Achieve high-throughput processing of challenging materials such as non-conductive or ion beam sensitive materials
☆ Achieve rapid and simple characterization of air sensitive samples without the need to transfer samples between different instruments for imaging and cross-sectional acquisition
All features of the Helios 5 PFIB platform are highly reliable, including high-quality gallium free TEM and APT sample preparation, as well as high-resolution imaging capabilities
