GZPK660Double discharge high-speed rotary tablet press, which adopts a dual forced feeding and dual discharge structure design, with a rotating punch plateComplete within a weekThe processes of secondary filling, metering, preloading, main pressing, and chip extraction. The equipment has stable working performance and the machine runs smoothlyLow noise. Replace a set of guide rails that can press double-layer sheets.
main features
Double layer three wheel packing system, balanced powder density.
Human machine interface touch screen software operation control, easy to operate, with fault point self diagnosis function.
Touch screen hydraulic control of main pressure wheel pressure and pre pressure wheel pressure, with low noise.
Handless wheel control, servo motor controlled filling system, fast response speed.
The automatic detection function for chip weight has been activated, and the automatic recognition and removal of waste chips has been implemented.
Up and down rush over tight protection, electrical control system protection, host overload shutdown protection, forced feeding motor overload protection, system failure
Fully automatic alarm protection.
The fully automatic lubrication system ensures that each lubrication point receives timed and quantitative lubrication through automatic control.
Production information can be displayed, printed, and stored.
Technical Parameter
|
parameter |
45 |
47 |
55 |
75 |
|
Number of punches |
45 |
47 |
55 |
75 |
|
Maximum production capacity (pieces/hour) |
432000 |
451200 |
528000 |
720000 |
|
Maximum filling depth |
20mm |
18mm |
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Maximum main compressive force |
100KN |
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Maximum pre compression force |
20KN |
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Tablet thickness range |
1 ~ 8mm |
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Disc diameter range |
25mm |
16mm |
13mm |
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Range of the long side of the alien film |
<25mm |
<18mm |
< 16mm |
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tablet weight variation |
±3% |
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Operating noise |
≤80dB |
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total power |
11.5-13KW |
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Equipment external dimensions |
1260x1260x1950 |
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Net weight of equipment |
3950 kg |
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notes |
The maximum output refers to the maximum output achieved when the wafer type is circular, with the highest wafer diameter and rotational speed. The yield varies depending on the diameter and type of the slices. |
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