Vertical wafer thinning machine (FD-150A, FD-200A, FD-320A, FD550A wafer thinning machine)

Main purpose:
This equipment is mainly used for high-speed thinning of non-metallic and metallic hard and brittle materials such as sapphire substrates, silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials for precision parts.
Main features of vertical thinning machine:

1. Suction cups can be divided into electromagnetic suction cups and vacuum suction cups according to customer process requirements. The size of the suction cup can be customized according to customer needs, with a diameter of 320-600mm..
2. The grinding wheel spindle adopts a precision high-speed rotating electric spindle, and the driving method is variable frequency speed regulation. The speed can be adjusted according to the driving mode supported by the PLC control system for different process requirements, ranging from 3000-8000 revolutions per minute.
3. The feed mode of the grinding wheel is divided into three stages, which can facilitate the setting of effective thinning schemes and improve the precision and surface effect after thinning,
4. The tool alignment method can work continuously for workpieces of different thicknesses with only one alignment without changing the grinding wheel and suction cup, without the need to align every time.
5. This machine adopts high-precision lead screw and guide rail components, and the driving mode is servo drive. The speed of the lead screw, which is the feed speed of the grinding wheel, can be correspondingly changed according to the driving mode controlled by PLC based on different materials and process requirements of the workpiece. The speed can be adjusted from 0.001-5mm/min, and the control feed accuracy is detected by a high-resolution grating ruler.
6. This machine adopts advanced Taiwanese brand PLC and touch screen, with high degree of automation, realizing human-machine dialogue, and easy to operate at a glance.

7. The equipment can detect grinding torque and automatically adjust the workpiece grinding speed to prevent deformation and damage caused by excessive pressure during the grinding process. It automatically compensates for the wear thickness of the grinding wheel and can reduce the thickness of the 150 diameter chip to 0.08mm without breaking. Moreover, the parallelism and flatness can be controlled within a range of ± 0.002mm.
2. High thinning efficiency, the LED sapphire substrate can be ground at a maximum speed of 48 microns per minute. The maximum grinding speed of silicon wafers per minute can reduce the thickness by up to 250 microns.
Main technical parameters:

The thinning effect image of the device: